Applications:
The primary system application
is
composite and metal bond repairs,
by heating and curing prepregs,
resins or adhesives.
Manufacturing applications
include
secondary bonding processes
normally accomplished with autoclaves
or ovens. Hot bonders are
also useful in R&D projects for
materials and processes.
The line of HEATCON®
Composite
Repair Systems can also be used to
control other resistive heat sources
for a wide variety of manufacturing
and repair applications.
Specifications:
-
Weighs Only 20lbs
(9.1Kg)
-
Dimensions - 18.5
In. x 14 In. x 9 In.
(469.9mm x 355.6mm x 228.6mm)
-
Hi-Bright Electroluminescent
VGA
Screen (4.75 In. x 5 In.)
-
On-Screen Text-Based
Prompts/Help Screen
-
Dynamic Alarm/Control
Integration
-
Select by Hottest,
Coldest, Average
of All or No. 1/No. 2 Thermocouples
(10 Thermocouple Inputs)
-
Selectable Metric
or English Units
-
90-264 VAC; 45-65
Hz
-
30 Amps for Maximum
Blanket Size
-
Power Failure Auto
Recovery
-
Stores up to 30 cure
profiles