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Heatcon Equipment

Applications:

The primary system application is
composite and metal bond repairs,
by heating and curing prepregs,
resins or adhesives.

Manufacturing applications include
secondary bonding processes
normally accomplished with autoclaves
or ovens. Hot bonders are
also useful in R&D projects for
materials and processes.

The line of HEATCON® Composite
Repair Systems can also be used to
control other resistive heat sources
for a wide variety of manufacturing
and repair applications.

Specifications:

  • Weighs Only 20lbs (9.1Kg)
  • Dimensions - 18.5 In. x 14 In. x 9 In.
    (469.9mm x 355.6mm x 228.6mm)
  • Hi-Bright Electroluminescent VGA
    Screen (4.75 In. x 5 In.)
  • On-Screen Text-Based Prompts/Help Screen
  • Dynamic Alarm/Control Integration
  • Select by Hottest, Coldest, Average
    of All or No. 1/No. 2 Thermocouples
    (10 Thermocouple Inputs)
  • Selectable Metric or English Units
  • 90-264 VAC; 45-65 Hz
  • 30 Amps for Maximum Blanket Size
  • Power Failure Auto Recovery
  • Stores up to 30 cure profiles

 

HCS9000B
Single Zone Bonder
  • Reliable
  • Easy to Use
  • Upgradeable
  • Superior Capabilities
  • Compact Size Portable
Meets Commercial Carry-On Size Requirements
 

Manufacturer Site :

www.heatcon.com

 

 

 

   

 

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